| 微电子技术中的材料兼容 |
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| 引用本文： | 庄庆德. 微电子技术中的材料兼容[J]. 微电子学, 1991, 21(4): 1-12 |
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| 作者姓名： | 庄庆德 |
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| 作者单位： | 东南大学微电子中心 |
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| 摘 要： | 微电子技术的发展对材料提出了更高的要求。本文评述了硅材料与其它半导体、绝缘物和导体的单片兼容技术及应用。
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| 关 键 词： | 微电子技术 微细加工 材料兼容 |
The Compatibility of Materials for Microelectronic Technology |
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| Zhuang Qingde. The Compatibility of Materials for Microelectronic Technology[J]. Microelectronics, 1991, 21(4): 1-12 |
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| Authors: | Zhuang Qingde |
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| Abstract: | The development of microelectronic technology has imposed more and more requirements on materials.In this paper,a review is made on monolithic compatibility of silicon with other semiconductors,insulators and conductors,and on its applications. |
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| Keywords: | Silicon GaAs Material compatibility technology SOI technology Silicon bonding technology |
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