水质对镀铜层表面质量的影响

镀层麻点是电镀加工的常见质量问题。铜合金眼镜架经预镀铜和光亮酸铜工艺处理，工序间普遍采用自来水水洗?分别在含有无机盐、有机物、游离性余氯的洗涤水中，试验各因素对预镀铜层表面质量的影响结果表明，洗涤水中游离性余氯是形成预镀铜层麻点的主要因素，产生麻点的游离性余氯含量以0.4mg／1。为界限值，由此提出控制预镀铜层麻点的有效措施

Influence of rinsing water on quality of copper electrodeposits

Having pits on deposits is the common defect in electroplating processing. Rinsing with tap water was popularly adopted between the procedures of strike copper plating and bright sulphate copper plating for copper alloy glasses.The influences of each factor in rinsing water respectively containing inorganic, organic substance and residual free-chloric on the surface quality of strike copper deposits were studied. The results show that the residual free-chloric in tap water for rinse is the main reason for pits formation, and the critical value of residual free-choric content is (0.4 mg/L.) Thereby, the available ways to control pits formation on strike copper deposits were presented.