| 高频微波印制板生产可行性设计 |
| |
| 引用本文： | 梁丽萍. 高频微波印制板生产可行性设计[J]. 印制电路信息, 2005, 0(9): 43-44 |
| |
| 作者姓名： | 梁丽萍 |
| |
| 作者单位： | 广州杰赛科技股份有限公司,510730 |
| |
| 摘 要： | 主要讲述了结合印制板生产工艺要求,设计高频微波印制板需要考虑的主要因素,并给出相关的设计参数。
|
| 关 键 词： | 印制板生产工艺 高频微波印制板的设计 |
Production Feasibility Design of High Frequency Microwave PCB |
| |
| Liang Liping. Production Feasibility Design of High Frequency Microwave PCB[J]. Printed Circuit Information, 2005, 0(9): 43-44 |
| |
| Authors: | Liang Liping |
| |
| Affiliation: | Liang Liping |
| |
| Abstract: | This article mainly focuses on what factor shall be taken into consideration based on the PCB production technics requirements during designing of the high frequency microwave PCB, and provides the related design param- eters. |
| |
| Keywords: | PCB production technics high frequency microwave PCB designing |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
