半导体硼柱形微靶电火花加工技术

在惯性约束聚变研究中,硼的柱形微靶可作为黑腔填充材料。本文通过电火花铣削加工技术,采用含碳较高的电介质,利用导电性能较好的钨钢作电极材料,实现了半导体硼柱形微靶加工。通过奥林巴斯测量显微镜对硼柱直径进行了测量,测量结果表明,硼柱的直径加工精度可控制在小于±10μm。采用扫描电镜对形貌进行了分析,结果表明,加工前后硼的表面形貌未改变。通过能谱分析了硼柱表面的导电层成分及通过X射线能谱(XPS)分析了碳元素价态,结果表明,电火花铣削加工过程中,由于电介质分解生成游离态的碳及电极材料熔融后沉积在硼表面,形成辅助导电层,通过对辅助导电层加工,产生的瞬时高温使硼熔融气化,从而实现对半导体硼的加工。

Electrical Discharge Machining Technology of Semiconductor Boron Cylindrical Micro-target

In the study of inertial confinement fusion,the boron cylindrical micro-target can be used as hohlraum filling material.In this paper,the boron cylindrical micro-target was machined by electrical discharge machining (EDM)milling technology,and the dielectric is material which has higher carbon content and the electrode material is tungsten steel which has good electrical conductivity.The boron column size was char-acterized by OLYMPUS STM6 measuring microscope.The results show that dimension precision of diameter is less than 10 μm.The morphology of the sample was analyzed by scanning electron microscopy (SEM).The results show that the surface morphology of boron is unchanged.The surface conductive layer of sample was characterized by energy dispersive spectrum (EDS)analysis and X-ray energy spectrum (XPS)analysis.The results show that during the EDM milling process,because the dielectric breaks into free carbon and the electrode material is fused and deposited on the surface of the work-piece,the auxiliary conductive layer is formed.Through machining processing of the auxiliary conductive layer,the instantaneous high temperature causes the boron to melt and gasify,thus machining processing of the semiconductor boron is realized.