| 延长自组织InAs／GaAs量子点发光波长的研究进展 |
| |
| 引用本文： | 吴静.延长自组织InAs／GaAs量子点发光波长的研究进展[J].中国材料科技与设备,2007,4(3):22-25. |
| |
| 作者姓名： | 吴静 |
| |
| 作者单位： | 湖北大学物理学与电子技术学院铁电压电材料与器件湖北省重点实验室,湖北武汉430062 |
| |
| 摘 要： | 在近几年的InAs／GaAs自组织量子点的研究中，如何荻得1．3～1．55μm。长波长量子点材料是一个很热门的课题。本文综述了各种延长自组织InAs／GaAs量子点发光波长的方法，并提出了实用化的最佳途径。
|
| 关 键 词： | InAs量子点 长波长 研究进展 |
Fine Lead-free Solder Paste for High Density Packaging and Its Key-preparation |
| |
| HUQiang, XUJun, ZHANG Fu-wen.Fine Lead-free Solder Paste for High Density Packaging and Its Key-preparation[J].Chinese Materials Science Technology & Equipment,2007,4(3):22-25. |
| |
| Authors: | HUQiang XUJun ZHANG Fu-wen |
| |
| Affiliation: | 1. National Engineering Research Center for Non-ferrous Metals Composites, General Research Institute for Non ferrous Metals,Beijing, 100088,China; 2. Beijing COMPO Solder Co. Ltd. , Beijing, 100088,China |
| |
| Abstract: | With the Electronics and Electrical Appliances minimization, low-costing, multifunction, super-high density, re liability and convenience, the electronic packaging developing toward to high integration, high performance, multilead, narrow pinch. Which require higher assembly technology and muti-functional soldering material. The development process of electronic assembly technology is summarized. The pertinent materials and preparation technology of fine Pb-free solder paste used in the high density assembly are discussed introduced. Besides, the preparation technology, current status and development trend of Pb-free solder powder are. The market prospect of Pb-free solder materials and the direction of corporations are analyzed combining with the situation of Cina. |
| |
| Keywords: | Solder paste Lead-free solder Preparation technology |
| 本文献已被 维普 等数据库收录！ |
|
