Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface-Finished Printed Circuit Board and Its Drop Impact Reliability 期刊界 All Journals 搜尽天下杂志传播学术成果专业期刊搜索期刊信息化学术搜索

Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface-Finished Printed Circuit Board and Its Drop Impact Reliability

摘要：