Analyses of single crystal diamond substrates grown in a pocket substrate holder via MPACVD |
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Affiliation: | 1. Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI 48824, United States;2. Department of Physics and Astronomy, Michigan State University, East Lansing, MI 48824, United States;1. A.M. Prokhorov General Physics Institute RAS, Vavilov str. 38, Moscow 119991, Russia;2. National Research Nuclear University MEPhI, Moscow 115409, Russia;3. Institute of Radio Engineering and Electronics RAS, Pl. Vvedenskogo 1, Fryazino 141190, Russia;1. Institute of Applied Physics, RAS, Nizhny Novgorod, Russia;2. Institute for Physics of Microstructures, RAS, Nizhny Novgorod, Russia |
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Abstract: | High quality single crystal diamond (SCD) substrates are required for several different important current applications. Microwave Plasma Assisted Chemical Vapor Deposition (MPACVD) is a convenient deposition method for high quality substrates. It is hence imperative to synthesize and analyze substrates grown via different CVD techniques. This paper describes the quality of single crystal diamond substrates which have been grown via one such deposition strategy, which is in a “pocket substrate holder” design. The growth process in such a holder helps in depositing substrates which have almost no polycrystalline diamond (PCD) rim growth. The exact pocket holder growth process at high pressures (240 Torr) and high microwave power densities (~ 500 W/cm3) has been discussed in a previous publication [1]. The SCD CVD substrates were analyzed with different characterization techniques. By synthesizing diamond substrates in a pocket holder, the lack of any/almost any PCD rim helped in reducing the amount of stress in the crystals. To study the electronic quality of the substrates, etching experiments were conducted to determine the etch pit density. Nomarski images confirm that the number of etch pits at the edges is higher than at the center of the etched surface thereby implying the feasibility of this simpler method of reducing the etch pit density. The pocket holder process thus not only reduces the PCD rim but also reduces the substrate etch pit density and hence shows good promise of delivering high quality substrates. |
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