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High aspect ratio structures obtained by electroforming in microstructured glass
Authors:D Hülsenberg  A Harnisch  C Jakob  M May  B Straube
Affiliation:1. Institute of Glass/Ceramics-Technology, Technical University of Ilmenau, Gustav-Kirchhoff-Str. 1, D-98693, Ilmenau, Germany
2. Institute of Materials, Technical University of Ilmenau, Gustav-Kirchhoff-Str. 1, D-98693, Ilmenau, Germany
Abstract:The application of glass in the microsystems technology becomes more and more important. Therefore, it is necessary to combine special microstrutturable glasses with various other materials (e.g. joining with silicon by anodic bonding, joining with metals by electroforming, joining with polymers by glueing, joining with various other glasses by brazing or diffusion welding). In order to increase the use of glass in the microsystems technology especially four fields of research are important:
  • -development of special glasses with various properties
  • -technologies of microstructuring
  • -technologies of joining
  • -application
  • These four topics are main research fields performed at the Institute of Glass/Ceramics-Technology and will be described in this paper.
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