Ultrasonic measurements of microelectronic resins

The elastic moduli, measured with the ultrasonic technique, of commercial silica filled epoxy resins used in the electronic circuits are reported. Measurements of velocity propagation and attenuation were carried out in large temperature and frequency ranges. Predictions of the theoretical models were compared with the experimental values. Explicit expressions of the elastic moduli were derived as functions of filler content and the properties of the matrix and the fillers. The influences of frequency and temperature on the elastic moduli and attenuation are discussed.