Microstructure and properties of the Si3N4/silica aerogel composites fabricated by the sol–gel method via ambient pressure drying |
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| Affiliation: | 1. Queensland Centre for Advanced Materials Processing and Manufacturing (AMPAM), School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, Queensland 4072, Australia;2. School of Science and Engineering, University of the Sunshine Coast, Sippy Downs, Queensland 4575, Australia;1. School of Materials, The University of Manchester, Manchester M13 9PL, United Kingdom;2. School of Mechanical, Aerospace & Civil Engineering, The University of Manchester, Manchester M13 9PL, United Kingdom;1. Laboratory for Microstructure & Institute of Materials, Shanghai University, Shanghai 200072, China;2. Chongqing Key Laboratory of Photo-electric Functional Materials, College of Physics and Electronic Engineering, Chongqing Normal University, Chongqing 400047, China;1. Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Janiszewskiego 11/17, 50-372 Wroclaw, Poland;2. Institute of Thin Films, Sensors & Imaging, University of the West of Scotland, Scottish Universities Physics Alliance, High Street, Paisley PA1 2BE, United Kingdom;3. University of Wroclaw, Institute of Experimental Physics, Max Born 9, 50-204 Wroclaw, Poland |
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| Abstract: | Si3N4 particle reinforced silica aerogel composites have been fabricated by the sol–gel method via ambient pressure drying. The microstructure and mechanical, thermal insulation and dielectric properties of the composites were investigated. The effect of the Si3N4 content on the microstructure and properties were also clarified. The results indicate that the obtained mesoporous composites exhibit low thermal conductivity (0.024–0.072 Wm? 1 K? 1), low dielectric constant (1.55–1.85) and low loss tangent (0.005–0.007). As the Si3N4 content increased from 5 to 20 vol.%, the compressive strength and the flexural strength of the composites increased from 3.21 to 12.05 MPa and from 0.36 to 2.45 MPa, respectively. The obtained composites exhibit considerable promise in wave transparency and thermal insulation functional integration applications. |
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