A user-friendly heat-resistant modified polymer-based adhesive for joining and repair of carbon/carbon composites |
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| Affiliation: | 1. Department of Design, Politecnico di Milano, Italy;2. Industrial Design Engineering, TUDelft, Netherlands;1. Laboratoire Génie des Matériaux, Ecole Militaire Polytechnique, BP17C Bordj El Bahri, Alger, Algeria;2. Laboratoire Physique Théorique et Physique des Matériaux LPTPM, Université Hassiba Ben Bouali, BP151 Hai Essalam, 02000 Chlef, Algeria;3. Laboratoire de Génie Civil et géo Environnement LGCgE, EA 4515, Faculté des Sciences Appliquées FSA Béthune, Université d''Artois, France;4. Université Lille Nord de France, USTL, LML, CNRS, UMR 8107, F-59650 Villeneuve d''Ascq, France;5. School of Metallurgical Engineering and Materials Science, Faculty of Engineering, Universidad Central de Venezuela, 47885, Los Chaguaramos, Caracas 1040, Venezuela;1. IFW Dresden, Institute for Complex Materials, Helmholtzstr. 20, D-01069 Dresden, Germany;2. Department of Materials Science and Metallurgical Engineering, Kyungpook National University, 702-701 Daegu, South Korea;3. Politehnica University of Timisoara, P-ta Victoriei 2, 300006 Timisoara, Romania;4. Center for Non-crystalline Materials, Department of Metallurgical Engineering, Yonsei University, 120-749 Seoul, South Korea;5. Department of Advanced Materials Engineering, Sejong University, 143-747 Seoul, South Korea;6. University of Technology Dresden, Institute of Materials Science, D-01062 Dresden, Germany |
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| Abstract: | A user-friendly heat-resistant modified polymer-based adhesive was developed to join C/C composites. After calcination at 1300 °C, the bonding effect of the adhesive reached the highest as more heat-resistant ceramics and high-temperature melting glass were generated in the adhesive. Its bonding strength was kept above 15 MPa during test from RT to 500 °C and the corresponding joints ruptured at C/C substrates. Besides, after repeated thermal-cycling at 1300 °C, the bonding strength at this temperature was maintained at about 12 MPa. For cured adhesive without calcination, its bonding strength could be maintained above 5 MPa during the whole heating process, which made it to have direct application in practice after curing. |
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