一种新型半模基片集成波导三孔定向耦合器

半模基片集成波导(HMSIW)是近年来出现的一种高性能平面导波结构,具有传输损耗小、功率容量大、易于集成等优点,已开始广泛应用于微波无源器件的设计中。文章基于HMSIW技术与PCB工艺技术设计制作了一种新颖的三孔定向耦合器,通过在耦合孔上金属面蚀刻"工"字形槽增加孔的耦合量。设计的HMSIW三孔定向耦合器不仅保持了集成基片波导(SIW)定向耦合器的所有优点,而且在面积上减小了近50﹪,工作带宽拓展到1GHz。实测数据与仿真结果基本吻合,验证了设计方法的正确性与可行性。

A New Three Apertures Directional Coupler Based on Half-Mode Substrate Integrated Waveguides

Half-Mode substrate integrated waveguide(HMSIW) was proposed in recent years as a kind of high-performance planar microwave transmission structure.With the advantages of low transmission loss,high power handing capacity and high integration ability.A number of high-performance components have been developed using this technique.Based on the HMSIW technology and the printed circuit board(PCB) process,a novel three aperture directional coupler is designed by etching I-shaped slots on the metallic surface of coupling aperture and verified with experiments.With all advantages of the substrate integrated waveguide(SIW),the proposed coupler is of 50% reduction in size and obtains 1GHz bandwidth in operating frequency.The measured results are in agreement with the simulated results by using Ansoft HFSS 10.0,which validates the concept of the HMSIW three apertures directional coupler and its design method.