| 温度对Cu颗粒增强复合钎料蠕变性能的影响 |
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| 引用本文： | 闫焉服,刘建萍,史耀武,郭福,夏志东.温度对Cu颗粒增强复合钎料蠕变性能的影响[J].材料科学与工艺,2004,12(6):658-661,665. |
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| 作者姓名： | 闫焉服 刘建萍 史耀武 郭福 夏志东 |
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| 作者单位： | 北京工业大学,材料科学与工程学院,北京,100022;北京工业大学,材料科学与工程学院,北京,100022;北京工业大学,材料科学与工程学院,北京,100022;北京工业大学,材料科学与工程学院,北京,100022;北京工业大学,材料科学与工程学院,北京,100022 |
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| 摘 要： | 蠕变性能是影响钎焊接头可靠性的重要指标之一.采用搭接面积为1 mm2的单搭接钎焊接头,在恒定载荷下,测定了Cu颗粒增强锡铅基复合钎料钎焊接头的蠕变寿命,分析并讨论了温度对该复合钎料蠕变寿命的影响.结果表明:Cu颗粒增强的锡铅基复合钎料的蠕变抗力优于传统63Sn37Pb共晶钎料;钎焊接头蠕变寿命随温度的升高而降低,并且温度对复合钎料钎焊接头蠕变寿命的影响较传统63Sn37Pb钎料明显.
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| 关 键 词： | 蠕变寿命 复合钎料 颗粒增强 63Sn37Pb 温度 |
| 文章编号： | 1005-0299(2004)06-0658-04 |
The influence of temperature on creep behavior of Cu particles enhanced SnPb based composite solder |
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| YAN Yan-fu,LIU Jian-ping,SHI Yao-wu,GUO Fu,XIA Zhi-dong.The influence of temperature on creep behavior of Cu particles enhanced SnPb based composite solder[J].Materials Science and Technology,2004,12(6):658-661,665. |
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| Authors: | YAN Yan-fu LIU Jian-ping SHI Yao-wu GUO Fu XIA Zhi-dong |
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| Abstract: | Creep property of solder alloys is one of the important factors to effect the reliability of SMT soldered joints.Single shear lap creep specimens with a 1 mm~2 cross sectional area are developed using Cu particles enhanced 63Sn37Pb based composite solder to examine the influence of temperature on creep behavior of the composite solder. Results indicate that the creep resistance of solder joints of Cu particles enhanced 63Sn37Pb based composite solder is superior to one of the solder joints of the conventional 63Sn37Pb solder. At the same time, creep rupture lifetimes of the solder joints of the composite solder decrease with increasement of temperature and fall down faster than those of the conventional 63Sn37Pb eutectic solder. |
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| Keywords: | creep rupture life composite solder particle-enhance 63Sn 37Pb temperature |
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