| Effects of deformation on microstructures and properties of submicron crystalline Cu-5%Cr alloy |
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| 引用本文： | 贺文雄 王尔德 陈晖 于洋 刘京雷. Effects of deformation on microstructures and properties of submicron crystalline Cu-5%Cr alloy[J]. 中国有色金属学会会刊, 2007, 17(2): 384-388. DOI: 10.1016/S1003-6326(07)60103-4 |
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| 作者姓名： | 贺文雄 王尔德 陈晖 于洋 刘京雷 |
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| 作者单位： | School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China |
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| 摘 要： | Warm extrusion of submicron crystalline Cu-5%Cr from 100 ℃ to 600 ℃ was investigated. The effects of different extrusion ratios and different extrusion temperatures on microstructures and properties of submicron crystalline Cu-5%Cr were studied. The microstructures of the extruded Cu-5%Cr were characterized by backscattered electron irnages（BSE） and transmission electron microscopy（TEM）. The mechanical properties of the extruded Cu-5%Cr were measured by means of microhardness and tension test. The results show that, the deformation, dynamic recovery and dynamic recrystallization of the extruded Cu-5%Cr are mainly produced in Cu matrix. The higher extrusion ratio leads to more uniform microstructure and finer Cu grains. When being extruded in the range of 100-600 ℃, dynamic recovery of Cu is the dominant process, and dynamic recrystallization of Cu occurred above 300 ℃ is far from end. The most part of microstructure of as-extruded Cu-5%Cr is subcrystaUines produced by dynamic recovery, only a few recrystallines exist, and the average size of these grains is not larger than 400 nm. With extrusion temperature rising, the tensile strength and microhardness of Cu-5%Cr decrease, and elongation increases gradually.
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| 关 键 词： | 形变 亚微细晶 Cu-Cr合金 显微结构 性质 |
| 收稿时间： | 2006-06-13 |
| 修稿时间： | 2006-12-27 |
Effects of deformation on microstructures and properties of submicron crystalline Cu-5%Cr alloy |
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| HE Wen-xiong,WANG Er-de,CHEN Hui,YU Yang,LIU Jing-lei. Effects of deformation on microstructures and properties of submicron crystalline Cu-5%Cr alloy[J]. Transactions of Nonferrous Metals Society of China, 2007, 17(2): 384-388. DOI: 10.1016/S1003-6326(07)60103-4 |
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| Authors: | HE Wen-xiong WANG Er-de CHEN Hui YU Yang LIU Jing-lei |
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| Affiliation: | School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China |
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| Abstract: | Warm extrusion of submicron crystalline Cu-5%Cr from 100 °C to 600 °C was investigated. The effects of different extrusion ratios and different extrusion temperatures on microstructures and properties of submicron crystalline Cu-5%Cr were studied. The microstructures of the extruded Cu-5%Cr were characterized by backscattered electron images(BSE) and transmission electron microscopy(TEM). The mechanical properties of the extruded Cu-5%Cr were measured by means of microhardness and tension test. The results show that, the deformation, dynamic recovery and dynamic recrystallization of the extruded Cu-5%Cr are mainly produced in Cu matrix. The higher extrusion ratio leads to more uniform microstructure and finer Cu grains. When being extruded in the range of 100–600 °C, dynamic recovery of Cu is the dominant process, and dynamic recrystallization of Cu occurred above 300 °C is far from end. The most part of microstructure of as-extruded Cu-5%Cr is subcrystallines produced by dynamic recovery, only a few recrystallines exist, and the average size of these grains is not larger than 400 nm. With extrusion temperature rising, the tensile strength and microhardness of Cu-5%Cr decrease, and elongation increases gradually. |
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| Keywords: | Cu-Cr alloy submicron crystalline extrusion dynamic recovery dynamic recrystallization |
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