溶胶- 凝胶法制备二氧化硅微球研究进展概述

由于二氧化硅热膨胀系数低,同时具有高耐热、高耐湿、低介电等优越性能,填充到环氧树脂中能有效降低环氧树脂的热膨胀系数、吸水率、收缩率和内部应力。因此二氧化硅在电子封装领域具有广泛的应用。文章综述了近些年来利用溶胶-凝胶过程制备二氧化硅微球的方法及制备过程中的影响因素,以及二氧化硅与环氧树脂的复合问题,并指出了二氧化硅在电子封装应用领域中所存在的问题及发展方向。

Review of Research Progress in Preparation of Sphere Silica Particles by Sol-Gel

With the characteristic of low coefficient of thermal expansion, high heat resistance, high wet resistance and low dielectric constants, silica could effectively reduce the coefficient of thermal expansion, water absorption, contraction ratio and inner stress of epoxy resin. So, silica has been widely used in the field of electronic packaging. The Sol-Gel methods developed in recent years for preparation of silica spheres, the process factors, and the study of being filled with epoxy resin were reviewed in this article. And the problems and development direction of silica applied in the field of electronic packaging were pointed out as well.