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The effect of contact of copper sulphide grains on the initial rate of leaching in oxygenated sulphuric acid solution
Authors:Tomasz Chmielewski  Janusz Lekki
Affiliation:Institute of Inorganic Chemistry and Metallurgy of Rare Elements, Technical University of Wroc?aw, 50-370 Wroc?aw Poland;Institute of Mining Engineering, Technical University of Wroc?aw, 50-370 Wroc?aw Poland
Abstract:The initial stage of leaching of chalcocite, bornite, and chalcopyrite as well as chalcocite-chalcopyrite and bornite-chalcopyrite mixtures in oxygenated aqueous sulphuric acid was investigated at 368 K. It was determined that chalcopyrite accelerates the rate of copper leaching from chalcocite due to grain contact between chalcocite and chalcopyrite. In contrast, chalcopyrite decreases the rate of dissolution of bornite.
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