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Placement of Substrate Contacts to Minimize Substrate Noise in Mixed-Signal Integrated Circuits |
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| Authors: | Radu M Secareanu Scott Warner Scott Seabridge Cathie Burke Thomas E Watrobski Christopher Morton William Staub Thomas Tellier Eby G Friedman |
| Affiliation: | (1) Department of Electrical and Computer Engineering, University of Rochester, Rochester, New York, 14627-0231;(2) Ink Jet Supplies Business Unit, Xerox Corporation, Webster, New York, 14580 |
| Abstract: | The placement of substrate contacts in epi and non-epi technologies is analyzed in order to control and reduce the substrate noise amplitude and spreading. The choice of small or large substrate contacts or rings for each of the two major technologies is highlighted. Design guidelines for placing substrate contacts so as to improve the noise immunity of digital circuits in mixed-signal smart-power systems are also presented. |
| Keywords: | substrate contacts subtrate noise mixed-signal epitaxial and non-epitaxial technologies |
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