| 新型纳米铜导热硅脂的研制和性能研究 |
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| 引用本文： | 俸颢,刘静茹. 新型纳米铜导热硅脂的研制和性能研究[J]. 化工新型材料, 2006, 34(11): 20-21 |
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| 作者姓名： | 俸颢 刘静茹 |
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| 作者单位： | 中南大学机电工程学院,长沙,410083;冰爽DIY俱乐部,武汉,430082 |
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| 基金项目： | 中南大学校科研和教改项目 |
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| 摘 要： | 用惰性气体蒸发法和电弧等离子体法制备了纳米铜粒子,以此作为导热填料,研制出了具有高导热系数的新型纳米铜导热硅脂.在LGA 775和Socket 939计算机平台上进行了试验,结果表明,新型硅脂能大大降低CPU的工作温度,并对此进行了机理分析.
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| 关 键 词： | 硅脂 纳米铜 导热性 导热填料 CPU |
| 修稿时间： | 2006-07-04 |
Development and study on a new nanocopper thermal silicone grease |
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| Feng Hao,Liu Jingru. Development and study on a new nanocopper thermal silicone grease[J]. New Chemical Materials, 2006, 34(11): 20-21 |
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| Authors: | Feng Hao Liu Jingru |
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| Abstract: | Nanocopper particles were prepared by evaporation in inert gas and arc plasma method,and used as thermal conducting fillers in a new nanocopper thermal silicone grease which has high coefficient of heat conductivity.The silicone grease was tested under the environment of LGA 775 and Socket 939,the results showed that the new grease can lowered the working temperature of CPU greatly.In addition,the mechanism was analyzed. |
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| Keywords: | silicone grease nanocopper thermal conductivity thermal conducting filler CPU |
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