An innovative technique for packaging power electronic buildingblocks using metal posts interconnected parallel plate structures |
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Authors: | Haque S Kun Xing Ray-Lee Lin Suchicital CTA Guo-Quan Lu Nelson DJ Borojevic D Lee FC |
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Affiliation: | Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA; |
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Abstract: | Power electronics building blocks (PEBBs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. At the Center for Power Electronics Systems, we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiber-optic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, for interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V dc bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double what could be achieved with commercially packaged devices of the same rating |
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