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Failure Mechanisms in Flip-Chip Bonding on Stretchable Printed Electronics |
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| Authors: | Mohammad H Behfar Behnam Khorramdel Arttu Korhonen Elina Jansson Aleksis Leinonen Markus Tuomikoski Matti Mäntysalo |
| Affiliation: | 1. VTT Research Center of Finland, Oulu, 90570 Finland;2. Faculty of Information Technology and Communication Sciences, Tampere University, 33720 Tampere, Finland |
| Abstract: | |
| Keywords: | failure mechanism flip-chip bonding hybrid integration printed stretchable electronics roll-to-roll printing |