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Direct Electroless Deposition of Nickel onto Silicon Nitride Ceramic: A Novel Approach for Copper Metallization of Micro-/Nano-fabricated Devices |
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| Authors: | Gul Zeb Thi Luong Duong Marek Balazinski Xuan Tuan Le |
| Affiliation: | 1. Sheba Microsystems, MaRS Centre, 101 College Street, Toronto, ON, M5G 1L7 Canada;2. Department of Mechanical Engineering, Polytechnique Montréal, Montréal, QC, H3C 3A7 Canada;3. Department of Industrialization & Chemical Processes, PCAS Canada (SEQENS), 725 rue Trotter, St-Jean-sur-Richelieu, Quebec, J3B 8J8 Canada |
| Abstract: | |
| Keywords: | autocatalytic nickel deposition copper electroplating diazonium-based amination direct modification filling of micro-nanostructures |