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Soft and Self-Adhesive Thermal Interface Materials Based on Vertically Aligned,Covalently Bonded Graphene Nanowalls for Efficient Microelectronic Cooling |
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| Authors: | Qingwei Yan Fakhr E. Alam Jingyao Gao Wen Dai Xue Tan Le Lv Junjie Wang Huan Zhang Ding Chen Kazuhito Nishimura Liping Wang Jinhong Yu Jibao Lu Rong Sun Rong Xiang Shigeo Maruyama Hang Zhang Sudong Wu Nan Jiang Cheng-Te Lin |
| Affiliation: | 1. Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201 P. R. China College of Materials Science and Engineering, Hunan University, Changsha, 410082 P. R. China;2. Department of Engineering, Applied Science Section, University of Technology and Applied Science, Nizwa, 611 Sultanate of Oman;3. Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201 P. R. China Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049 P. R. China;4. Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201 P. R. China;5. State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082 P. R. China;6. Advanced Nano-Processing Engineering Lab, Mechanical Engineering, Kogakuin University, Tokyo, 192-0015 Japan;7. Academy for Advanced Interdisciplinary Studies, Southern University of Science and Technology, Shenzhen, 518055 P. R. China Guangdong-Hong Kong-Macao Joint Laboratory for Photonic-Thermal-Electrical Energy Materials and Devices, Southern University of Science and Technology, Shenzhen, 518055 P. R. China;8. Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055 China;9. Department of Mechanical Engineering, The University of Tokyo, 7-3-1 Hongo, Bunkyo-Ku, Tokyo, 113-8656 Japan;10. Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing, 100190 P. R. China;11. Academy for Advanced Interdisciplinary Studies, Southern University of Science and Technology, Shenzhen, 518055 P. R. China;12. Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201 P. R. China |
| Abstract: | Urged by the increasing power and packing densities of integrated circuits and electronic devices, efficient dissipation of excess heat from hot spot to heat sink through thermal interface materials (TIMs) is a growing demand to maintain system reliability and performance. In recent years, graphene-based TIMs received considerable interest due to the ultrahigh intrinsic thermal conductivity of graphene. However, the cooling efficiency of such TIMs is still limited by some technical difficulties, such as production-induced defects of graphene, poor alignment of graphene in the matrix, and strong phonon scattering at graphene/graphene or graphene/matrix interfaces. In this study, a 120 µ m-thick freestanding film composed of vertically aligned, covalently bonded graphene nanowalls (GNWs) is grown by mesoplasma chemical vapor deposition. After filling GNWs with silicone, the fabricated adhesive TIMs exhibit a high through-plane thermal conductivity of 20.4 W m−1 K−1 at a low graphene loading of 5.6 wt%. In the TIM performance test, the cooling efficiency of GNW-based TIMs is ≈ 1.5 times higher than that of state-of-the-art commercial TIMs. The TIMs achieve the desired balance between high through-plane thermal conductivity and small bond line thickness, providing superior cooling performance for suppressing the degradation of luminous properties of high-power light-emitting diode chips. |
| Keywords: | covalently bonded structures graphene nanowalls high through-plane thermal conductivity mesoplasma chemical vapor deposition thermal interface materials |