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封装用抗腐蚀高可靠性银合金丝
引用本文:林良,臧晓丹.封装用抗腐蚀高可靠性银合金丝[J].电子与封装,2014(3):9-13.
作者姓名:林良  臧晓丹
作者单位:烟台一诺电子材料有限公司,山东烟台264006
摘    要:介绍一种在封装工艺中可用于替代昂贵金丝的抗腐蚀高可靠性银合金丝。利用表面钝化和固溶合金、二次中频合金熔炼和定向连续拉铸工艺,分别从成分和工艺方面提高了银合金丝的机械性能、抗腐蚀性、可靠性等一系列键合性能,解决了普通银丝在使用过程中存在的电子迁移问题,推动了键合银合金丝的广泛使用。

关 键 词:键合银合金丝  表面钝化  固溶技术  二次中频熔炼  定向连续拉铸  抗腐蚀性  高可靠性

Introduction of a Corrosion-resistant High-reliability Silver Alloy Bonding Wire in Package
LIN Liang,ZANG Xiaodan.Introduction of a Corrosion-resistant High-reliability Silver Alloy Bonding Wire in Package[J].Electronics & Packaging,2014(3):9-13.
Authors:LIN Liang  ZANG Xiaodan
Affiliation:( YanTai YesNo Electronic Materials Co., LTD., Yantai 264006, China)
Abstract:The paper introduces the silver bonding wire with high corrosion resistance and reliability, which can be used to instead of the expensive gold bonding wire. Surface passivation, solid amalgamation alloy, secondary intermediate smelting and directional continuous casting process are used to produce YesNo silver bonding wire. It improves the mechanical property, corrosion resistance, reliability and other bonding performance of the silver bonding wire from the component and processes. Silver bonding wire has solved the electron transfer problem in ordinary silver bonding wire. Silver bonding wire is more and more used.
Keywords:silver based bonding wire  surface passivation  solid amalgamation alloy  secondary intermediate smelting  directional continuous casting  corrosion resistance  high reliability
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