| 国外宇航级混合集成电路发展浅析 |
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| 引用本文： | 门国捷.国外宇航级混合集成电路发展浅析[J].电子与封装,2014(7):44-48. |
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| 作者姓名： | 门国捷 |
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| 作者单位： | 中国电子科技集团公司第43研究所,合肥230088 |
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| 摘 要： | 分析了美国、欧洲、日本等国家发展宇航级混合集成电路的策略、宇航标准体系和产品制造商质量体系认证等情况,详细介绍了美国Crane Interpoint、Natel公司等国际知名企业研发宇航级混合集成电路产品的概况。探讨了未来国际宇航级混合集成电路的技术和产品发展趋势,最后分析了国内外技术研究水平的差距,提出了发展中国宇航混合集成电路产品的建议。
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| 关 键 词： | 宇航 混合集成电路 标准 |
Development of Aerospace Hybrid Integrated Circuit at Abroad |
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| MEN Guojie.Development of Aerospace Hybrid Integrated Circuit at Abroad[J].Electronics & Packaging,2014(7):44-48. |
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| Authors: | MEN Guojie |
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| Affiliation: | MEN Guojie (China Electronics Technology Group Corporation No.43 Research Institute, Hefei 230088, China) |
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| Abstract: | The paper analyzes the American,Europe,and Japan to develop the space level HIC manufacturers of strategy,standard and products quality system certification.Introduced the Crane Interpoint,Natel Engineering Company,and Other famous company about the R＆D of HIC.Discusses the development trend of the technologies and products in the space level HIC.Finally the level of technology at home and abroad is analysed,on the basis of discussion above,the technology gap between domestic and foreign research is concluded,and several suggestions on the research and development of HiC products in China are put forward. |
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| Keywords: | aerospace hybrid integrated circuits standards |
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