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MCU芯片Multi-Sites测试中几个值得关注的问题
引用本文:陈真,;陆锋,;张凯虹. MCU芯片Multi-Sites测试中几个值得关注的问题[J]. 电子与封装, 2014, 0(6): 12-14
作者姓名:陈真,  陆锋,  张凯虹
作者单位:[1]江南大学物联网工程学院,江苏无锡214122; [2]中国电子科技集团公司第58研究所,江苏无锡214035
摘    要:介绍了MCU芯片Multi-Sites测试方法,针对MCU芯片Multi-Sites测试的难点,阐述了在MCU芯片Multi-Sites测试过程中经常影响测试系统和测试效率的问题。主要提出了MCU芯片MultiSites测试过程中的直流参数测试、功能测试的影响因素和解决方案,并对MCU芯片Multi-Sites测试过程中经常遇到的干扰因素进行分析,尽可能保证MCU芯片Multi-Sites测试过程中获得的各项性能参数稳定可靠。

关 键 词:MCU  Multi-Sites  直流参数测试  功能测试

Some Focus Issues in MCU Chip Multi-Sites Testing
Affiliation:CHEN Zhen, LU Feng, ZHANG Kaihong ( 1. School oflnternet of Thins Engineering, Jiangnan University, Wuxi 214122, China; 2. China Electronics Technology Group Corporation No.58 Research Institute, Wuxi 214035, China)
Abstract:Describes the MCU chip Multi-Sites Test Method for Multi-Sites MCU chip test difficulty, elaborated MCU chip Multi-Sites in the testing process often affects the efficiency of the test system and test problems, mainly made MCU chip testing process Multi-Sites the DC parametric testing, functional testing of influencing factors and solutions, and the MCU chip Multi-Sites often encountered during testing interference factors were analyzed, as far as possible to ensure the MCU chip Multi-Sites obtained during testing of the performance parameters stable and reliable.
Keywords:MCU  Multi-Sites  DC parametric testing  functional testing
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