| 合金焊料盖板选择与质量控制 |
| |
| 引用本文： | 丁荣峥,;马国荣,;史丽英,;李杰,;张军峰.合金焊料盖板选择与质量控制[J].电子与封装,2014(2):1-4. |
| |
| 作者姓名： | 丁荣峥 ;马国荣 ;史丽英 ;李杰 ;张军峰 |
| |
| 作者单位： | [1]江苏省宜兴电子器件总厂,江苏宜兴214221; [2]中国电子科技集团公司第58研究所,江苏无锡214035; [3]无锡天和电子有限公司,江苏无锡214062 |
| |
| 摘 要： | 在平行缝焊、储能焊、玻璃熔封、激光焊、合金焊料熔封等密封工艺中,合金焊料密封是高可靠密封的优选工艺。文章针对合金焊料密封工艺中常遇到的密封强度、密封内部气氛、焊缝及盖板耐腐蚀、薄形封装易短路等问题,介绍了通过合金焊料盖板的选择,从而控制密封强度、密封内部气氛、耐蚀性能和电性能等的质量。
|
| 关 键 词： | 盖板 密封 合金焊料 |
Frames-lids-preforms Selection and Quality Control |
| |
| Affiliation: | DING Rongzheng, MA Guorong, SHI Liying, LI Jie, ZHANG Junfeng ( 1. Jiangsu Province Yixing Electronic Device General Factory, Yixing 214221, China; 2. China Electronics Technology Group Corporation No.58 Research Institute, Wuxi 214035, China; 3. Wuxi TianHe Electronics Co., Ltd., Wuxi 214062, China) |
| |
| Abstract: | In parallel to the seam welding, energy storage welding, low temperature glass seal, laser welding, solder alloy melt sealing process, the solder alloy is highly reliable sealing sealing preferred way. This paper focuses on the strength of the alloy solder seal, the internal atmosphere, corrosion-resistant, ultra-thin package easy to short-circuit problem. Introduces the solder alloy frames-lids-preforms selection to control the seal strength, the internal atmosphere, corrosion and electrical properties and other quality. |
| |
| Keywords: | frames-lids-preforms solder seal |
| 本文献已被 CNKI 维普 等数据库收录！ |
|
