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极大规模集成电路测试技术发展
引用本文:刘远华.极大规模集成电路测试技术发展[J].电子与封装,2014(7):16-18.
作者姓名:刘远华
作者单位:上海华岭集成电路技术股份有限公司,上海201203
摘    要:集成电路作为新一代信息战略产业的基础,工艺、封装、应用的发展对测试提出了诸多挑战,同时测试作为集成电路产业链的一环,与设计、制造、封装等环节紧密相联。阐述了集成电路设计中高速、高集成度及测试成本对测试的挑战以及相应的测试解决方案,同时对测试与设计、封装、应用等产业链环节联接的典型技术如测试仿真到测试向量转换、inkless map、测试自动化数据等进行了描述。

关 键 词:高速接口测试  高集成度  测试经济性  测试向量压缩

Trend of Ultra Large-scale Integrated Circuit Testing Technology
LIU Yuanhua.Trend of Ultra Large-scale Integrated Circuit Testing Technology[J].Electronics & Packaging,2014(7):16-18.
Authors:LIU Yuanhua
Affiliation:LIU Yuanhua (Sino IC Technology Co., Ltd., Shanghai 201203, China)
Abstract:As the basis of a new generation of strategic industry information,the development of integrated circuits process,package,and application presents many challenges to test.While test is an important link of IC industry chain,it is closely linked with design,manufacture,packaging and other sectors.The paper describes the test challenges and the corresponding test solutions for the integrated circuit with the design technologies such as high speed,high integration.Meanwhile,the typical technical for linking the industrial chain e.g.testing and design,packaging,and other industrial applications are described,including test simulation,test pattern conversion,inkless map,test automation data.
Keywords:high speed interface test  high level of integration  cost reduction techniques  pattern compression
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