金刚石/铜复合散热材料的制备和检测

金刚石/铜复合材料具有高的热导率和可调的热膨胀系数,是一种极具竞争力的新型电子封装材料,可作为散热材料广泛应用于高功率、高封装密度的器件中。文中从工程化的角度出发,对应用中的瓶颈因素进行了研究。为改善其钎焊性能,采用磁控溅射、电镀等方法在金刚石/铜表面获得了附着力、可焊性良好的Ti-Cu-Ni-Au复合膜层。在此基础上进行了钎焊试验,金锡焊料在复合膜层上铺展良好、无虚焊。对金刚石/铜的散热效果与钼铜片做了对比试验,结果表明,在相同条件下,与钼铜热沉片相比,降温幅度超过20℃,具有更优异的散热效果。

Preparation and Measure of Diamond/Cu Heat Dissipation Materials

As a new generation of electronic packaging material, Diamond/Cu composites have excellent performances such as high thermal conductivity and adjustable CTE.The bottle-neck factors in the application were studied in this paper. In order to improve the solder ability, Ti-Cu-Ni-Au compotmd-plating on Diamond/Cu was produced by PVD and ECD, the compound-plating has good adhesion strength and solder ability. Furthermore, compotmd-plating has good wettability with Au80Sn20. The result show that, Diamond/Cu has more excellent effectiveness of heat-emission on the same condition, which the temperature fall reach 20 ℃ compare to MoCu.