LTCC互连基板金属化孔工艺研究

LTCC基板互连金属化孔工艺技术是低温共烧陶瓷工艺过程中的关键技术,它直接影响陶瓷基板的成品率和可靠性。文章从影响互连金属化孔的因素出发,介绍了金属化通孔填充工艺及控制技术、金属化通孔材料热应力的影响、金属化通孔材料收缩率的控制等三方面技术,并给出了如下的解决方案。采用合适的通孔填充工艺技术和工艺参数;合理设计控制通孔浆料的收缩率和热膨胀系数,使通孔填充浆料与生瓷带的收缩尽量一致,以便降低材料的热应力;金属化通孔烧结收缩率的控制可以通过导体层的厚度、烧结曲线与基板烧结收缩率的关系、叠片热压的温度和压力等方面来实现。

The Research of THT Metallization Technical on LTCC Substrate

The THT metallization is a key technique of low temperature co-fired ceramic （LTCC） substrate process, which affects the yield and reliability of final ceramic substrate directly. In this paper, the influencing factors of THT metallization were discussed in detail, mainly contained three aspects： the filling process and control technique, the heat stress of filling materials, and the shrinkage control of filling materials. The corresponding solutions were also introduced respectively. The results displayed that the filling material and tape shrinkage can be controlled to match well by adopting appropriate technical parameter of via filling process and selecting the filling material with suitable shrinkage and TCE. It is also found that the sintering shrinkage of tape was dominated by the thickness of conductor layer, sintering curve, the temperature and pressure of lamination and hot-press process.