The interface crack problem for bonded piezoelectric and orthotropic layers under antiplane shear loading |
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Authors: | F Narita Y Shindo |
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Affiliation: | (1) Department of Materials Processing, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan |
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Abstract: | The primary objective of this paper is to study the influence of the electroelastic interactions on the stress intensity factor
in bonded layers of piezoelectric and orthotropic materials containing a crack along the interface under antiplane shear.
Attention is given to a two-layer hybrid laminate formed by adding a layer of piezoelectric ceramic to a unidirectional graphite/epoxy
composite or an aluminum layer. Electric displacement or electric field is prescribed on the surfaces of the piezoelectric
layer. The problem is formulated in terms of a singular integral equation which is solved by using a relatively simple and
efficient technique. A number of examples are given for various material combinations. The results show that the effect of
the electroelastic interactions on the stress intensity factor and the energy release rate can be highly significant.
This revised version was published online in July 2006 with corrections to the Cover Date. |
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Keywords: | Elasticity fracture mechanics integral transform piezoelectric material layered material interface crack stress intensity factor energy release rate |
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