| 高体积分数SiCP/ Al 复合材料电子封装盒体的制备 |
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| 引用本文： | 褚克,贾成厂,尹法章,梅雪珍,曲选辉. 高体积分数SiCP/ Al 复合材料电子封装盒体的制备[J]. 复合材料学报, 2006, 23(6): 108-113 |
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| 作者姓名： | 褚克 贾成厂 尹法章 梅雪珍 曲选辉 |
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| 作者单位： | 高体积分数SiCP/ Al 复合材料电子封装盒体的制备 |
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| 基金项目： | 国家自然科学基金，民口配套项目 |
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| 摘 要： | 采用注射成型方法制备了SiCP封装盒体的预成型坯, 用压力浸渗方法将熔融铝浸渗到SiCP封装盒体的预成型坯中, 制备出含SiCP体积分数为65 %的SiCP / Al 复合材料的封装盒体。SEM 观察表明, 经过压力浸渗后SiCP / Al 复合材料组织均匀且致密化高, 室温热膨胀系数为8. 0 ×10-6 / K, 热导率接近130 W/ (m·K) , 密度为2198 g/ cm3 , 能够很好地满足电子封装的要求。
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| 关 键 词： | SiCP / Al 复合材料 脱脂 注射成型 压力熔渗 |
| 文章编号： | 1000-3851（2006）06-0108-06 |
| 收稿时间： | 2005-12-05 |
| 修稿时间： | 2005-12-052006-03-27 |
Fabrication on electronic package box of SiCP/ Al composites with high volume fraction of SiCP |
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| CHU Ke,JIA Chengchang,YIN Fazhang,MEI Xuezhen,QU Xuanhui. Fabrication on electronic package box of SiCP/ Al composites with high volume fraction of SiCP[J]. Acta Materiae Compositae Sinica, 2006, 23(6): 108-113 |
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| Authors: | CHU Ke JIA Chengchang YIN Fazhang MEI Xuezhen QU Xuanhui |
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| Affiliation: | School of Materials Science and Technology| University of Science and Technology Beijing| Beijing 100083| China |
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| Abstract: | The SiCP preformed compact was prepared by Powder Injection Molding ( PIM) , and the melting aluminum penet rated into the SiCP preformed compact by the pressure infilt ration method to manufacture the elect ronicpackage box of SiCP (65 %) / Al composites. SiCP (65 %) / Al composite manufactured by pressure infilt ration has highdensity and homogeneous microst ructure. The density of the composite is 2. 98 g/ cm3 ; the thermal expansion coefficient and thermal conductivity of the composite are 8. 0 ×10 -6 / K and nearly 130 W/ (m·K) at room temperature ,respectively , which is up to the request of the elect ronic package. |
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| Keywords: | SiCp/Al composites debind PIM pressure infiltration |
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