| 超细金粉在电子浆料中的应用 |
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| 引用本文： | 杜红云.超细金粉在电子浆料中的应用[J].电子元件与材料,2001,20(4):16-17. |
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| 作者姓名： | 杜红云 |
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| 作者单位： | 昆明贵金属研究所, |
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| 摘 要： | 讨论了#1和#2两种超细金粉在电子浆料中的应用。#1超细金粉用于印刷型金导体浆料中，线分辨率高，性能稳定。#2超细金粉应用于焊接型金导体浆料，满足欧姆接触和附着力的要求。
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| 关 键 词： | 超细金粉 焊接金浆 金导体浆料 |
| 文章编号： | 1001-2028(2001)04-0016-02 |
Application of Super-fine Powdered Gold on Electronic Paste |
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| DU Hong-yun.Application of Super-fine Powdered Gold on Electronic Paste[J].Electronic Components & Materials,2001,20(4):16-17. |
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| Authors: | DU Hong-yun |
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| Abstract: | The applications of #1和#2 super-fine powdered gold on electronic paste are discussed. #1 is designed for printing conductors and #2 for welding. With #1 powder, the conductor line resolution goes higher; and with #2, ohm contact and adhesion meet the requirements. |
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| Keywords: | super-fine powdered gold gold paste for welding gold paste for conductor |
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