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| 化学镍/化学钯/浸金的表面涂覆层的可焊性和可靠性 | |
| 引用本文： | 林金堵,吴梅珠.化学镍/化学钯/浸金的表面涂覆层的可焊性和可靠性[J].印制电路信息,2011(5):43-48. |
| 作者姓名： | 林金堵 吴梅珠 |
| 作者单位： | 江南技术技术研究所,江苏,无锡,214083 |
| 摘 要： | 概述了化学镍/化学钯/浸金(ENEPIG)表面涂(镀)覆层的优点。它比化学镍/浸金(ENIG)有更好的可焊接性和焊接可靠性。化学镍/化学钯/浸金表面涂(镀)覆层应该是有发展前景的。 |
| 关 键 词： | 化学镍/化学钯/浸金 表面涂(镀)覆层 焊接点 无铅焊接 金属丝键合 可靠性评价 |
The solderability and the reliability of ENEPIG final finish |
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| LIN Jin-du,WU Mei-zhu.The solderability and the reliability of ENEPIG final finish[J].Printed Circuit Information,2011(5):43-48. | |
| Authors: | LIN Jin-du WU Mei-zhu |
| Affiliation: | LIN Jin-du WU Mei-zhu |
| Abstract: | The paper describes that the advantage of the electroless nickel/ electroless palladium/immersion gold(ENEPIG) final finish.It is more than the solderability and the reliability of electroless nickel/ immersion gold(ENIG) finish.Electroless nickel/ electroless palladium/immersion gold(ENEPIG) final finish has very good developmental prospectg. |
| Keywords: | electroless nickel/electroless palladium/immersion gold(ENEPIG) surface finish soldering point lead-free soldering wire bonding(WB) reliability evaluation |
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