| 印制板镀铜面OSP抗氧化处理与应用 |
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| 引用本文： | 程静,陈良,吴培常.印制板镀铜面OSP抗氧化处理与应用[J].印制电路信息,2011(8):38-41. |
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| 作者姓名： | 程静 陈良 吴培常 |
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| 作者单位： | 广东成德电路股份有限公司,广东佛山,528300 |
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| 摘 要： | 对印制板表面处理作了简单的回顾,然后重点讲述OSP的反应机理,OSP产品的特点,OSP成膜过程以及乙酸和氨的初值对成膜的敏感依赖性和微蚀对成膜的影响,以及运用OSP成膜机理解决生产中出现的品质问题。近年来,OSP作为印制板表面处理的主流,有取代热风整平工艺及松香工艺的趋势,更适合电子工艺中SMT技术发展及环保方面的要求。
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| 关 键 词： | OSP处理 OSP成膜机理 反应历程 顺序反应 |
PCB surface OSP treatment and application in production |
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| CHNG Jing CHEN Liang WU Pei-chang.PCB surface OSP treatment and application in production[J].Printed Circuit Information,2011(8):38-41. |
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| Authors: | CHNG Jing CHEN Liang WU Pei-chang |
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| Affiliation: | CHNG Jing CHEN Liang WU Pei-chang |
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| Abstract: | This text made a simple review to the PCB surface processing,the important reactive mechanics of OSP,the characteristics of OSP product,the course of OSP that formed film,acetic acid and ammonia water initial value sensitive dependence to formed film,micoetching to formed film,and exercising mechanism of the OSP which formed film to solve qualitative blemish during producing,In recent years,the OSP becomes the main PCB surface processing,it becomes trend to replace HASL techniques and rosin techniques,which is more suitable for the SMT technique in the electronic tech requirement of the development and environmental protection. |
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| Keywords: | surface processing of OSP OSP s mechanism which formed film course of reaction sequential reaction |
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