| 金刚石线锯切割设备现状分析 |
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| 引用本文： | 周世威,郑超,刘莹,王进保,苏钰,程煜.金刚石线锯切割设备现状分析[J].超硬材料工程,2012,24(3):49-52. |
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| 作者姓名： | 周世威 郑超 刘莹 王进保 苏钰 程煜 |
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| 作者单位： | 1. 中国有色桂林矿产地质研究院有限公司,广西桂林,541004;国家特种矿物材料工程技术研究中心,广西桂林5410041;广西超硬材料重点实验室,广西桂林541004
2. 桂林理工大学材料科学与工程学院,广西桂林,541004 |
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| 基金项目： | 国家科技部科研院所技术开发专项资金;项目 |
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| 摘 要： | 随着光伏、半导体等高精端产业的发展，硬脆性材料，如晶体硅、蓝宝石、特种陶瓷等材料的切割加工显得尤为重要。近年来，世界各国大力投入研究开发，新工艺，新设备不断涌现。金刚石线锯切割成为研究和发展的主流趋势，文章介绍国外切割设备研究的最新进展以及国内发展状况，分析其性能优势，展望金刚石线切割设备应用前景。
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| 关 键 词： | 线切割设备 金刚石线锯 综述 多线切割 金刚石环线切割机 |
The status analysis of diamond wire saw cutting equipment |
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| Authors: | ZHOU Shi-wei ZHENG Chao LIU Ying WANG Jin-bao SU Yu CHENG Yu |
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| Affiliation: | 1. China Nonferrous Metal (Guilin) Geology and Mining Co., Ltd., Guilin, Guangxi 541004, China; 2. National Special Mineral Materials Engineering Research Center, Cruilin, Guangxi 541004, China ; 3. Guangxi Key Laboratory of Superhard Material Research and Development, Guilin, Guangxi 541004, China; College of Materials Science and Engineering, Guilin University of Technology, Guilin, Guangazi 541004, China} |
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| Abstract: | With the high precision development of photovoltaic industry and semiconductor industry, the cutting processing of hard-brittle materials is becoming more and more important such as single crystal silicon, polycrystalline silicon, precious stones, ceramic etc. In the recent years, due to the countries all over the world devote to research and develop the cutting equipment, the new technology and new equipment constantly emerge. And the diamond wire saw cutting equipment become the mainstream trend of research and development. This paper introduces the latest progress in abroad and development situation at domestic of wafer cutting equipment, analyses its performances and advantages, and prospects the application foreground of diamond wire cutting equipment. |
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| Keywords: | wire cutting equipment diamond wire saw review multi-wire cutting diamond endless wire cutting machine |
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