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无压熔渗制备SiCp/Al复合材料的界面改性研究进展
引用本文:任淑彬,何新波,曲选辉. 无压熔渗制备SiCp/Al复合材料的界面改性研究进展[J]. 材料科学与工艺, 2005, 13(5): 556-560
作者姓名:任淑彬  何新波  曲选辉
作者单位:北京科技大学,材料科学与工程学院,北京,100083
摘    要:研究表明,SiCp/Al间界面润湿性的好坏是采用无压熔渗法制备高体积分数SiCp/Al复合材料的最关键因素,也是影响复合材料性能的主要因素.本文从界面反应和界面润湿性角度出发,综述了近几年来国内外关于SiCp/Al复合材料的界面研究情况.

关 键 词:界面改性  SiCp/Al复合材料  熔渗  无压熔渗  SiCp  复合材料性能  界面改性  研究进展  modification  interfacial  studies  progress  Present  process  infiltration  情况  界面研究  界面反应  影响  因素  高体积分数  法制  界面润湿性
文章编号:1005-0299(2005)05-0556-05
收稿时间:2003-12-23
修稿时间:2003-12-23

Present progress of studies on interfacial modification in SiCp/Al composites fabricated by infiltration process
Ren Shu-bin,He Xin-bo,Qu Xuan-hui. Present progress of studies on interfacial modification in SiCp/Al composites fabricated by infiltration process[J]. Materials Science and Technology, 2005, 13(5): 556-560
Authors:Ren Shu-bin  He Xin-bo  Qu Xuan-hui
Affiliation:School of Materials Science and Engineering, Beijing University of Science and Technology, Beijing 100083, China
Abstract:It is well known that the wettability between SiC and Al plays the most important role in the fabrication of SiCp/Al composites with high volume fraction by infiltration process, which also is the major factor responsible for the properties of the composites. In this paper, research status of interface modification is reviewed with respect to interfacial reaction and wettability between SiCp and Al.
Keywords:interracial modification    SiCp/Al composites    infiltration
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