| 高柔软性无卤覆盖膜的研制 |
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| 引用本文： | 刘生鹏,谢飞,茹敬宏,伍宏奎. 高柔软性无卤覆盖膜的研制[J]. 印制电路信息, 2010, 0(6): 59-60,70 |
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| 作者姓名： | 刘生鹏 谢飞 茹敬宏 伍宏奎 |
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| 作者单位： | 广东生益科技股份有限公司,广东东莞,523039 |
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| 摘 要： | 文章介绍了覆盖膜对柔软性的要求，采用一种高柔软性的环氧树脂制备了高柔软性的覆盖膜，同时对柔软性的量化方法进行了描述，并从高聚物粘弹性的本质分析了回弹力测试过程中的应力松弛现象。
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| 关 键 词： | 高柔软性 覆盖膜 回弹力 应力松弛 |
Research on Low Stiffness Halogen-Free Coverlay |
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| LIU Sheng-peng,XIE Fei,RU Jing-hong,WU Hong-kui. Research on Low Stiffness Halogen-Free Coverlay[J]. Printed Circuit Information, 2010, 0(6): 59-60,70 |
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| Authors: | LIU Sheng-peng XIE Fei RU Jing-hong WU Hong-kui |
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| Affiliation: | LIU Sheng-peng XIE Fei RU Jing-hong WU Hong-kui |
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| Abstract: | The requirement on low stiffness of coverlay is introduced. One kind of low stiffness coverlay was prepared by low stiffness epoxy resin. Meanwhile the quantification method of low stiffness was explained, also stress relaxation phenomenon during the testing of resilience force was analysed based on the viscoelasticity of polymer. |
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| Keywords: | Low stiffness Coverlay Resilience force Stress relaxation |
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