| 红外装置ZnS窗口崩边原因分析与工艺改进 |
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| 引用本文： | 苗蓉丽. 红外装置ZnS窗口崩边原因分析与工艺改进[J]. 理化检验(物理分册), 2010, 0(1): 64-65 |
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| 作者姓名： | 苗蓉丽 |
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| 作者单位： | 中国空空导弹研究院; |
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| 摘 要： | 某型红外装置ZnS窗口出现崩边。采用扫描电镜对断口进行了宏观和微观检验,对ZnS窗口崩边的原因进行了分析。结果表明:ZnS窗口崩边是脆性断裂。并提出了工艺改进措施。
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| 关 键 词： | 红外装置 ZnS窗口 崩边 脆性断裂 |
Broken Reason Analysis of ZnS Window Edge of Infrared Device and Process Improvement |
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| MIAO Rong-li. Broken Reason Analysis of ZnS Window Edge of Infrared Device and Process Improvement[J]. Physical Testing and Chemical Analysis Part A:Physical Testing, 2010, 0(1): 64-65 |
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| Authors: | MIAO Rong-li |
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| Affiliation: | China Airborne Missile Academy/a>;Luoyang 471009/a>;China |
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| Abstract: | The ZnS window edge of infrared device was broken.The broken reason was analyzed by means of macro and micro examination by scanning electronic microscope.The results showed that the fracture mode of the infrared device ZnS window was brittle fracture.The improvement measures were put forward. |
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| Keywords: | infrared device ZnS window broken edge brittle fracture |
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