含芳醚芴二胺/环氧树脂固化反应动力学及性能研究

以9,9-双4-4-氨基苯氧基苯基]芴(BAOFL)作为固化剂,采用非等温DSC技术,研究了BAOFL/环氧树脂(E-51、TDE-85和芴基环氧树脂)体系的固化反应动力学,利用动态热机械分析仪(DMA)和热重分析仪(TGA)测试了固化树脂的力学性能和热稳定性。结果表明,固化反应活化能与环氧树脂和固化剂的结构密切相关,芳醚的引入提高了氨基与环氧基的反应性,固化树脂呈现出优良的热性能和力学性能,其玻璃化转变温度(T)达到206~248℃,贮能模量为2.54~2.94 GPa,初始热分解温度312~375℃,700℃g时的残炭率达到15.2%~31.7%。()

Curing kinetics and properties of epoxy resins/fluorene diamine containing aryl ether linkage

In this study,the curing kinetics of 9,9-bis4-（4-aminophenoxy）phenyl]fluorene （BAOFL） with different epoxy resins including diglycidyl ether of bisphenol A （E-51）,cycloaliphatic epoxy resin （TDE-85） and diglycidyl ether of bisphenol fluorene （DGEBF） was investigated using nonisothermal differential scanning calorimetry （DSC） by Kissinger and Ozawa methods.The thermal properties of obtained polymers were evaluated by dynamic mechanical thermal analysis （DMA） and thermogravimetric analysis （TGA）.The results showed that the values of activation energy （Ea） werea strongly dependent on the structures of epoxy resin and curing agent.The curing reactivity between amino groups and epoxy groups in the epoxy system was improved by introduction of the flexible aryl ether linkages into the chain backbone.The cured polymers exhibited higher glass transition temperature （Tg）,lower rigidity and better thermal stability compared tog those of the corresponding epoxy resins/fluorenyl diamine without aryl ether linkages.The cured product of epoxy resin/BAOFL has a Tg of and a 206-248 storage modulus of 2.54-2.94 GPa.The thermal decomposition temperatureg℃weight loss and the char yield at 700 of the cured polymer were 312-375℃ and 15.2%-31.7%,respectively.