Diamond deposition on copper treated hardmetal substrates |
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| Affiliation: | 1. Lomonosov Moscow State University, Faculty of Chemistry, Leninskiye Gory 1-3, GSP-1, Moscow 119991, Russia;2. National University of Science and Technology “MISIS”, Leninskiy prospekt 4, Moscow 119049, Russia;3. Kurnakov Institute of General and Inorganic Chemistry of the Russian Academy of Sciences, Leninskiy prospekt 31, Moscow 119991, Russia;1. State Key Laboratory of Microbial Technology, Shandong University, No.72 Binhai Road, Qingdao 266237, PR China;2. College of Material Science and Engineering, Key Laboratory of Advanced Structural Materials, Ministry of Education, Changchun University of Technology, Changchun 130012, China;3. Shenyang National Lab of Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China;4. Department of Mechanical Engineering, University of Saskatchewan, Saskatoon, SK, Canada S7N 5A9 |
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| Abstract: | The adhesion of diamond coatings onto hardmetal substrates is improved by a copper deposition produced by a cementation from aqueous CuSO4 solutions. During this reaction Co is dissolved from the substrate surface and copper is deposited. To obtain homogeneous Cu deposits, the influence of CuSO4 concentration and reaction time on cementation were investigated.During diamond deposition, Cu reduces the surface mobility of Co, which is necessary to decrease deposition of non-diamond carbon and therefore increase adhesion. Indentation tests showed the good adhesion of the diamond coatings qualitatively.Cu precipitation and diamond deposition were examined by scanning electron microscopy (SEM). The diamond quality was detected by Raman spectroscopy. Using secondary ion mass spectroscopy (SIMS) depth profiles the interface and the Cu distribution were characterized indicating that during diamond deposition Cu is dissolved and forms an intermetallic Co–Cu mixed crystal. |
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