Microstructure and mechanical strength of transient liquid phase bonded Ti3SiC2 joints using Al interlayer

Based on the structure characteristic of Ti₃SiC₂ and the easy formation of Ti₃Si_1?xAl_xC₂ solid solution, a transient liquid phase (TLP) bonding method was used for bonding layered ternary Ti₃SiC₂ ceramic via Al interlayer. Joining was performed at 1100–1500 °C for 120 min under a 5 MPa load in Ar atmosphere. SEM and XRD analyses revealed that Ti₃Si(Al)C₂ solid solution rather than intermetallic compounds formed at the interface. The mechanism of bonding is attributed to aluminum diffusing into the Ti₃SiC₂. The strength of joints was evaluated by three point bending test. The maximum flexural strength reaches a value of 263 ± 16 MPa, which is about 65% of that of Ti₃SiC₂; for the sample prepared under the joining condition of 1500 °C for 120 min under 5 MPa. This flexural strength of the joint is sustained up to 1000 °C.