| 基于树脂封装的三维微波组件热布局研究 |
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| 引用本文： | 吴金财,严伟,黄红艳.基于树脂封装的三维微波组件热布局研究[J].中国电子科学研究院学报,2011,6(1):17-19,27. |
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| 作者姓名： | 吴金财 严伟 黄红艳 |
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| 作者单位： | 1. 南京电子技术研究所,210039
2. 桂林电子科技大学,541004 |
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| 摘 要： | 采用树脂封装三维微波组件是微波组件小型化、轻量化发展的一个趋势.介绍了基于树脂封装的三维组件基本结构,通过有限元热仿真分析方法,得出了大功率微波芯片(MMIC)在树脂封装中的位置布局原则.
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| 关 键 词： | 三维微波组件 热布局优化 树脂封装 |
Research on 3D Microwave Modules Thermal Placement Optimization Based on Resin Packaging |
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| WU Jin-cai,YAN Wei,HUANG Hong-yan.Research on 3D Microwave Modules Thermal Placement Optimization Based on Resin Packaging[J].Journal of China Academy of Electronics and Information Technology,2011,6(1):17-19,27. |
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| Authors: | WU Jin-cai YAN Wei HUANG Hong-yan |
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| Affiliation: | WU Jin-cai1,YAN Wei1,HUANG Hong-yan2(1.Nanjing Research Institute of Electronics Technology,Nanjing210039,China,2.Guilin University of Electronic Technology,Guangxi Guilin541004,China) |
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| Abstract: | Resin package 3D microwave modules is fit for the requirement of more and more small modules.This paper describes 3D microwave modules structure based on resin packaging.The monolithic microwave integrated circuit(MMIC) placement rules in resin was summarized through thermal placement optimization by finite element analysis(FEA). |
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| Keywords: | 3D microwave modules thermal placement optimization resin packaging |
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