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Microstructure coarsening during static annealing of 60Sn40Pb solder joints: II eutectic coarsening kinetics
Authors:Kang Jung  Hans Conrad
Affiliation:(1) Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, P.R. China;
Abstract:The eutectic coarsening kinetics for 60Sn40Pb solder joints annealed at 50°C to 150° C was determined to be of the form
[`(D)]n - [`(D)]on = Ko exp( - Q/RT)tbar D^n - bar D_o^n = K_o exp ( - Q/RT)t
Keywords:
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