| 电路系统接地技术研究 |
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| 引用本文： | 贺良飞. 电路系统接地技术研究[J]. 安徽电子信息职业技术学院学报, 2014, 0(6): 1-3 |
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| 作者姓名： | 贺良飞 |
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| 作者单位： | 电子信息测试技术安徽省重点实验室 中国电子科技集团公司第四十一研究所,安徽 蚌埠,233006 |
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| 摘 要： | 在电路设计中,接地的重要性众所周知,电子产品的很多问题都与接地的处理密切相关。本文通过对几种典型的接地方法,如PCB接地设计、多板卡系统接地设计、混合信号系统接地设计及取样时钟电路接地设计等进行分析,尽量避免在电路系统的设计过程中因为接地而出现的各种问题。
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| 关 键 词： | 接地设计 PCB 混合信号系统 |
Study of Grounding Technologies of Circuit System |
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| HE Liang-fei. Study of Grounding Technologies of Circuit System[J]. Journal of Anhui Vocational College of Electronios & Information Technology, 2014, 0(6): 1-3 |
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| Authors: | HE Liang-fei |
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| Affiliation: | HE Liang-fei (The 41st Institute of CETC, Bengbu 233006, Anhui) |
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| Abstract: | The importance of grounding technology is well-known in circuit design. A large number of problems with electronic products are closely related to grounding issues. Some typical grounding technologies, such as the PCB grounding technology, the grounding technology of multi-board system, the grounding technology of mixed signal system and the grounding technology of sampling clock circuit, are analyzed so that many problems with grounding technology can be avoided in circuit design. |
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| Keywords: | grounding technology PCB mixed signal system |
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