| 铜导电胶电性能的研究 |
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| 引用本文： | 许佩新,陈治中,谢文明.铜导电胶电性能的研究[J].材料科学与工程学报,1998(1). |
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| 作者姓名： | 许佩新 陈治中 谢文明 |
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| 作者单位： | 浙江大学 |
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| 摘 要： | 以改性树脂和混合树脂为粘料，铜粉为导电性填料，并配以适当添加剂、固化剂制备铜导电胶。该胶具有电阻率较低，性能稳定，粘接力强等优点。
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| 关 键 词： | 铜导电胶，体积电阻率，混合树脂，添加剂 |
Study on Electric Property of Copper Conductive Adhesive |
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| Xu Peixin\ Chen Zhizhong\ Xie Wenming Zhejiang University,Hangzhou.Study on Electric Property of Copper Conductive Adhesive[J].Journal of Materials Science and Engineering,1998(1). |
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| Authors: | Xu Peixin\ Chen Zhizhong\ Xie Wenming Zhejiang University Hangzhou |
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| Affiliation: | Xu Peixin\ Chen Zhizhong\ Xie Wenming Zhejiang University,Hangzhou,310027 |
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| Abstract: | Copper conductive adhesive is prepared by using modified resins and mixed resins as cohesive materials and Copper powders as conductive fillers.Some appropriate additives,solidfying agents are required.This adhesive has such advantages as low resistance,stable performance and good adhesiveness. |
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| Keywords: | Copper conductive adhesive Volume resistivity Mixed resins Additives |
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