Silicate formation at the interface of Pr-oxide as a high-K dielectric and Si(001) surfaces |
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| Affiliation: | 1. Brandenburgische Technische Universität Cottbus, Angewandte Physik-Sensorik, 03013 Cottbus, P.O. Box 101344, Germany;2. University of Wisconsin-Madison, Department of Physics, B408 Sterling Hall, 1150 University Avenue, Madison, WI 53706-1390, USA;3. Istituto di Microeletronica e Microsistemi, IMM-CNR, Stradale Primosole 50, 95127 Catania, Italy;4. Dipartimento di Scienze Chimiche, Università di Catania, and INSTM, UdR Catania, v.le A. Doria 6, 95125 Catania, Italy |
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| Abstract: | The composition and chemical bonding of the first atoms across the interface between Si(001) and the dielectric determine the quality of dielectric gate stacks. An analysis of that hidden interface is a challenge as it requires both, high sensitivity and elemental and chemical state information. We used X-ray absorption spectroscopy in total electron yield and total fluorescence yield at the Si2p and the O1s edges to address that issue. We report on results of Pr2O3/Si(001) as prepared by both, epitaxial growth and metal organic chemical vapor deposition (MOCVD), and compare to the SiO2/Si(001) system as a reference. We find evidence for the silicate formation at the interface as derived from the characteristic features at the Si2p and the O1s edges. The results are in line with model experiments in which films of increasing film thickness are deposited in situ on bare Si(001) surfaces. |
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