Integrated chip-size antennas for wireless microsystems: Fabrication and design considerations |
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| Affiliation: | 1. Department of Industrial Electronics, University of Minho, Campus de Azurém, 4800-058 Guimarães, Portugal;2. Laboratory of HiTeC/DIMES, Delft University of Technology, Postbus 5031, 2600GA Delft, The Netherlands;1. Department of Electronic Engineering, City University of Hong Kong, Kowloon, Hong Kong;2. State Key Laboratory of Millimeter Waves, City University of Hong Kong, Hong Kong;1. Department of Physical Electronics, Masaryk University, Kotlá?ská 2, CZ-61137 Brno, Czech Republic;2. Leibniz Institute for Plasma Science and Technology e.V., 17489 Greifswald, Felix-Hausdorff-Strasse 2, Germany;1. GMME-CEMDATIC-ETSIT, Universidad Politécnica de Madrid, Spain;2. Engineering Sciences, Uppsala University, Uppsala, Sweden;1. Tikrit University, Faculty of Engineering, Department of Mechanical Engineering, Tikrit, Iraq;2. Universiti Teknologi Petronas, Faculty of Engineering, Department of Mechanical Engineering, Bandar Seri Iskandar, Perak Darul Ridzuan, Malaysia;3. VIA University College, School of Technology and Business, Mechanical Engineering Department, Horsens, Denmark;1. Young Researchers and Elite Club, South Tehran Branch, Islamic Azad University, Tehran, Iran;2. Department of Electrical Engineering, Imam Khomeini International University, Qazvin, Iran;3. Faculty of Electrical and Computer Engineering, University of Tabriz, Tabriz, Iran |
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| Abstract: | This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5–6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of ～200 MHz at the return loss of ?10 dB and a simulated radiation efficiency of 60% were achieved. |
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