Strain rate measurement by Electronic Speckle Pattern Interferometry: A new look at the strain localization onset

In-plane Electronic Speckle Pattern Interferometry has been successfully used during tensile testing of semi-hard copper sheets in order to measure the strain rate. On one hand, heterogeneity in strain rate field has been found before the maximum of the tensile force (ɛ^t ≃ 19.4 and 25.4%, respectively). Thus, a localization phenomenon occurs before the classic Considère's criterion (dF = 0) for the diffuse neck initiation. On the other hand, strain rate measurement before fracture shows the moment where one of the two slip band systems becomes predominant, then strain concentrates in a small area, the shear band. Uncertainty evaluation has been carried out, which shows a very good accuracy of the total strain and the strain rate measurements.