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热分析在光电模块可靠性设计上的应用研究
引用本文:宋蓓莉,杨电,赵先明,徐红春.热分析在光电模块可靠性设计上的应用研究[J].激光与光电子学进展,2011(7):61-67.
作者姓名:宋蓓莉  杨电  赵先明  徐红春
作者单位:武汉邮电科学研究院光纤通信技术和网络国家重点实验室;武汉电信器件有限公司;
摘    要:元器件计数法是目前国内外针对光电模块可靠性设计的通用方法,为了改善没有成熟光电模块产品就无法有效进行可靠性预计的问题,在产品设计阶段通过运用流体仿真分析软件以XFP(10 G小型可插拔)模块为例模拟分析其在不同温度条件下的工作状态.完成了XFP模块的热分析,给出了XFP模块可靠性设计的优化办法,得到了XFP模块可靠性预...

关 键 词:光通信  可靠性预计  热分析  XFP模块

Application of Thermal Analysis on Reliability Design of Optoelectronic Modules
Song Beili, Yang Dian, Zhao Xianming, Xu Hongchun, State Key Laboratory of Optical Co mmunication Technologies , Networks,Wuhan Research Institute of Posts , Telco mmunication,Wuhan,Hubei ,China Wuhan Teleco mmunication Devices Co.Ltd.,China.Application of Thermal Analysis on Reliability Design of Optoelectronic Modules[J].Laser & Optoelectronics Progress,2011(7):61-67.
Authors:Song Beili  Yang Dian  Zhao Xianming  Xu Hongchun  State Key Laboratory of Optical Co mmunication Technologies  Networks  Wuhan Research Institute of Posts  Telco mmunication  Wuhan  Hubei  China Wuhan Teleco mmunication Devices CoLtd  China
Affiliation:Song Beili1,2 Yang Dian1,2 Zhao Xianming1,2 Xu Hongchun1,2 1State Key Laboratory of Optical Co mmunication Technologies and Networks,Wuhan Research Institute of Posts and Telco mmunication,Wuhan,Hubei 430074,China 2Wuhan Teleco mmunication Devices Co.Ltd.,China
Abstract:Components of counting method is the general method of the reliability design of optoelectronic modules at home and abroad.In order to improve the problem that no mature optoelectronic modules the reliability prediction can not be effectively carried out,in product design stage by using Flow Simulation softwar,and working status of XFP(10G small form factor pluggable) module,for example,is simulation analyzed under different temperature conditions.The thermal analysis of XFP module is finished,and the optim...
Keywords:optical communications  reliability prediction  thermal analysis  XFP module  
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