| 化学镀锡液中添加剂的影响研究 |
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| 引用本文： | 孙武,李宁,苏晓霞,赵杰.化学镀锡液中添加剂的影响研究[J].材料保护,2007,40(1):35-38. |
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| 作者姓名： | 孙武 李宁 苏晓霞 赵杰 |
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| 作者单位： | 哈尔滨工业大学应用化学系,黑龙江,哈尔滨,150001 |
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| 摘 要： | 所选定的化学镀锡液体系为硫酸盐体系,用浓度-电位曲线研究了不同配位剂对铜电极电位和锡电极电位的影响,并通过镀锡层厚度测定和表面形貌观察研究了化学镀锡液中不同种类的表面活性剂和抗氧化剂对镀层的影响.分别给出了在化学镀锡液中选择各种添加剂的方法,提出了化学镀锡液体系的最佳配方为:20～40 g/L硫酸亚锡,30～60 mL/L浓硫酸,80～120 g/L硫脲,60～100 g/L次亚磷酸钠,1.0～3.0g/L表面活性剂,2.0～5.0 g/L对苯二酚.
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| 关 键 词： | 化学镀锡 配位剂 电极过程 镀层性能 化学 镀锡液 添加剂 影响 研究 Properties Coating Electrode Process Bath Plating Electroless Additives 对苯二酚 次亚磷酸钠 硫脲 浓硫酸 硫酸亚锡 配方 最佳 方法 |
| 文章编号： | 1001-1560（2007）01-0035-04 |
| 修稿时间： | 2006-07-24 |
Effect of Additives in Electroless Tin Plating Bath on Electrode Process and Coating Properties |
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| SUN Wu,LI Ning,SU Xiao-xia,ZHAO Jie.Effect of Additives in Electroless Tin Plating Bath on Electrode Process and Coating Properties[J].Journal of Materials Protection,2007,40(1):35-38. |
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| Authors: | SUN Wu LI Ning SU Xiao-xia ZHAO Jie |
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| Abstract: | Theeffects of various complexing agents on the potential of Cu and Sn electrodes in elect roless tin plating from a sulfate bath were investigated using concentrahon-polential curves. The thickness of the resulting Sn coating was measured, while its morphology was observed as well, aiming at revealing the effects of various surfactants and antioxidants on the structure and properties of the Sn coating. Moreover, the methods for the selection of various additives for eleclroless tin plating were briefed. It was found that the target electroless Sn coating of desired properties could he obtained using an optimized formulation and optimized electroless plating parameters. |
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| Keywords: | eleclroless Sn plating completing additive electrode process coating properties |
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